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    Двосторонній єврозабор у Вінниці: практичне рішення для сучасної ділянки

    Доставка та Монтаж Єврозаборів

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Home Odisha News

Odisha Govt Signs Semiconductor Substrate Manufacturing Pact With Intel, 3DGS: Ashwini Vaishnaw

shree1news by shree1news
May 29, 2026
in Odisha News
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Odisha Govt Signs Semiconductor Substrate Manufacturing Pact With Intel, 3DGS: Ashwini Vaishnaw

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On Friday, Union Minister for Electronics and Information Technology Ashwini Vaishnaw announced that the Odisha government has signed a memorandum of understanding (MoU) with Intel and 3D Glass Solutions (3DGS) to introduce substrate manufacturing technology to India.

Vaishnaw congratulated the state government, Intel and 3DGS on signing the pact aimed at introducing substrate manufacturing capabilities in India through a post on social media platform X.

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“Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India. This will further advance semiconductor ecosystem in India,” the minister said in a post.

The latest development builds on Odisha’s broader semiconductor push announced earlier this year.

The foundation stone for the country’s first advanced 3D chip packaging machine was placed in April at Info Valley in Bhubaneswar as part of the Heterogeneous Integration Packaging Solutions project, which was promoted by 3D Glass Solutions.

The project, which would cost almost Rs 2,000 crore, is planned to produce around 70,000 glass panels per year, as well as 50 million assembled units and nearly 13,000 sophisticated 3D heterogeneous integration (3DHI) modules, the ministry said.

At the time, Union Minister Ashwini Vaishnaw stated that under Prime Minister Narendra Modi’s leadership, India’s semiconductor sector is rapidly expanding, with Odisha emerging as a key contributor to the country’s semiconductor goals.

Furthermore, Chief Minister Mohan Charan Majhi stated that the state became the first one in the country to develop both India’s first compound semiconductor fabrication unit and its first 3D glass substrate packaging facility.

The move comes as the Centre works to improve the domestic semiconductor ecosystem through regulatory support and incentives under the Semicon India Programme.

Earlier this week, the government announced that 12 fab or packaging projects and 24 semiconductor design projects had been approved under the scheme.

Furthermore, the government has established an online Investor Support service to increase investor confidence and handle sector problems.

 

 

Source: IANS

Tags: Odisha Govt.Odisha news

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